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Peripheral Imaging Corporation
PI3012A 300DPI CIS Sensor Chip Engineering Data Sheet
Description:
Peripheral Imaging Corporation PI3012A CIS sensor chip is a 300 dot per inch resolution linear array image sensor chip which utilizes PIC's proprietary CMOS Image Sensing Technology. This image sensor is to be used for butting end-to-end on a printed circuit board (PCB) using chip-on-board technology to form a scanning array with various lengths. Applications for the sensor array are facsimile, scanner, check reader, and office automation equipment. Figure 1 is a block diagram of the sensor chip. Each sensor chip consists of 96 detector elements,
8080m
1 2 3 4
ROW OF 96 SENSORS AND VIDEO SIGNAL LINE MULTIPLEXER
93
94
95
96
READOUT SHIFT REGISTER
380m
BUFFER
BUFFER CP VDD DGND
CHIP SELECT IOUT
BUFFER EOS
SP
PI3012A SENSOR CHIP FIGURE 1 BLOCK DIAGRAM
their associated multiplexing switches, buffers, and a chip selector. The detector element-to-element spacing is approximately 84.6 m. The size of each chip without scribe lines is 8080 m by 380 m. Each sensor chip has 6 bonding pads. The pad symbols and functions are described in Table 1.
PAGE 1 of 7 PI3012A6, 6/9/99
SYMBOL SP CP VDD DGND IOUT EOS
FUNCTION Start Pulse: Input to start the line scan. Clock Pulse: Input to clock the Shift Register. Positive Supply: +5 volt supply connected to substrate. Digital Ground: Connection topside common. Signal Current Output: Output for video signal current End of Scan Pulse: Output from the shift register at end of scan. Table 1. Pad Symbols and Functions
Bonding pad layout diagram:
8080 m
SENSOR DIE
Y
380m
IOUT B1 W1 EOS
SP
X
WCBE
CP
VDD
GND
X
NOTE: ALL PAD OPENNINGS ARE 140 X 80 m EXCEPT FOR THE TEST PADS, WHICH ARE 80 X 80 m.
PAD
SP CP VDD VSS IOUT EOS W C B E B1 W1
FUNCTION
START INPUT CLOCK INPUT + 5 VOLT SUPPLY GROUND VIDEO SIGNAL OUT SCAN OUTPUT TP TP TP TP TP TP
Y
30 30 30 30 30 30 30 30 30 30 30 30
X
742.5 2767.0 3124.5 3419.0 5095.5 7000.1 1162.5 1312.5 1658.0 1807.0 5407.0 5672.0
NOTES: 1. THE DRAWING IS NOT TO SCALE. 2. THE DIE LENGTH AND WIDTH ARE GIVEN AS SHOWN. 3. THE PAD LOCATIONS ARE GIVEN IN THE TABLE. 4. THERE ARE TWO EXAMPLES OF THE X AND Y LOCATIONS SHOWN ON THE FIRST TWO PADS. THEY ARE MEASURED TO THE LEFT BOTTOM CORNER OF THE PAD OPENNING. 5. ALL DIMENSIONS ARE IN m. 6. TP ARE TEST POINTS, THEY ARE NOT TO BE BONDED OUT.
FIGURE 2. PI3012A PAD LAYOUT AND DIE SIZE.
Figure 2 shows the bonding pad locations for PI3012A Sensor Chip relative to the lower left corner of the die. the die.
Electro-Optical Characteristics (25 o C)
Table 2, below, lists the electro-optical characteristics of PI3012A sensor chip at 25o C.
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Parameters Number of Photo-elements Pixel-to-pixel spacing Line scanning rate Clock frequency Output voltage
Symbols Tint * (1) f * (2) Vp*(3)
Typical 96 84.6 1.3 2.0 200
Units elements mm ms/line MHz mV
Notes
Level is adjustable see (3) This measurement was directly taken on the video line without an amplifier.
Output voltage non-uniformity Chip-to-chip non-uniformity Dark output voltage Dark output non-uniformity
Up *(4) Ud Vd * (5) Ud * (6)
7.5 7.5 10 <15
% % mV mV
Table 2. Electro-Optical Characteristic
Notes: (1) Tint stands for the line scanning rate or the integration time. It is determined by the time interval between two start pulses. (2) f stands for the input clock frequency: @ 1.0 MHz the total active line scan time for a A4 CIS module is 2.6 ms of the line integration time. @ 2.0 MHz the total active line scan time for a A4 CIS module is 1.3 ms of the line integration time. (3) Vp is a video output signal. It is converted from the signal current by charging the video line capacitance. An amplifier buffers the video line capacitance and allows line to charge, and the line is discharged through a shunting switch that shunts it to ground. This amplifier also provides a variable gain, typically 4 to 5 times the voltage that is measured on the video line. Hence, as indicated in the schematic, the video output level is adjustable. (4) Up = [(Vpmax-Vp)/Vp]x100% Or [(Vp-Vpmin)/Vp]x100% Where Vp = (Vpmax+Vpmin)/2 Vpmax is the maximum pixel output voltage in the light. Vpmin is the minimum pixel output voltage in the light. Note: In the light means the sensor is exposed to the light. (5) Vd = (Vdmax+Vdmin)/2 Vdmax is the maximum pixel output voltage in the dark. Vdmin is the minimum pixel output voltage in the dark. Note: In the dark means that sensor is light shielded and has no exposure to the light. (5) Ud = [(Vdmax-Vdmin)/Vd]x100%
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Absolute Maximum Ratings:
Parameters Power Supply Voltage Power Supply Current Input clock pulse (high level) Input clock pulse (low level) Operating Temperature Operating Humidity Storage Temperature Storage Humidity Symbol VDD IDD Vih Vil Top Hop Tstg Hstg Maximum Rating 10 <2.0 Vdd + 0.5 -0.25 0 to 50 10 to 85 -25 to 75 10 to 90 Units Volts ma Volts Volts o C RH % o C RH %
Recommended Operating Conditions at Room Temperature
Parameters Power Supply Input clock pulses high level Input clock pulse low level Operating high level exposed output Clock Frequency Clock pulse duty cycle Clock pulse high durations Integration time Operating Temperature Symbol VDD Vih Vil Iout f tw Tint Top Min. 4.5 2.8 0 0.1 Typical 5.0 5.0 0 2.0 25 0.125 1.3 25 Max. 5.5 VDD 0.8 5.0 Units Volts Volts Volts MHz % sec ms o C Notes 1 1 2 3 4 4 3
10 50
Notes: (1) Applies to both CP and SP. (2) The output is a current that is proportional to the charges, which are integrated on the phototransistor's base via photon-to-electron conversion. Accordingly during read out, these charges are discharged from the base through the transistor's emitter proportionally to the Beta of the phototransistor. Hence, the emitter current, that flows to the output video line, is the signal that is proportional to the photon integrated charges. To gain the optimum performance, the signal interfacing circuits are designed consistently with this signal process. The video signal current is made to flow into a virtual ground, while the signal extraction circuit is made to integrate these charges that converts these charges into the output signal voltage. The circuit used for the converting the current charge to voltage is attached to this document as a separate sheet. (3) Although the clock frequency will operate the device at less than 100KHz, it is recommended that the device be operated above 500KHz to maintain the devices performance characteristic. (4) The clock duty cycle typically is 25 %. However, it can operate with duty cycle as large as 50 %. This specified duty cycle is suggested because the 25 % of clock time, or the positive time of the clock, is used in the reset process, while the remainder of the time is used inextracting the signal during each pixel. Accordingly at low clock frequencies, it would help the
PAGE 4 OF 7 PI3012A, 6/9/99
operation if the duty cycle is less than 25 %. On the other hand, since the clock can operate with a 50% duty cycle the operator has additional timing flexibility if it desired.
Switching Characteristics @ 25 o C.
to CP tprh
tw
terdl tdh SP tefdl
tds Vout ts/h EOS (END OF SCAN)
tdl
Figure 3. Timing Diagram of the PI3012 A Sensor
Item Clock cycle time Clock pulse width (1) Clock duty cycle Data setup time Data hold time Prohibit crossing time (2) EOS rise delay EOS fall delay Signal delay time (3) Signal settling time (3)
Symbol to tw tds tdh tprh terdl tefdl tdl ts/h
Minimum 200 50 25 50 20
Mean
Maximum 10000 75
50
20 60 70 20 90
Units ns ns % ns ns ns ns ns ns ns
PAGE 5 OF 7 PI3012A, 6/9/99
1. Clock pulse width varies with frequency, as it was explained foregoing paragraphs. The number given in table is the minimum value regardless of the clock frequency. 2. Prohibit crossing time to insure that two start pulses are not locked into the shift register in any single scan time. 3. Pixel delay times and settling time depend on the output amplifier, which is employed. The numbers, which are given, are measured with an EL2044 amplifier. Note the impulse signal current out of the device is within 10 ns. Hence, the faster the amplifier with a quick settling time and with a lower input capacitance will allow the signal to rise and settle quickly with speeds greater than those given above.
Output Circuits for Video Signal
The circuit, attached on this document as separate page, is a recommended module circuit for operating the sensors. It was also used in the forgoing characterization of the sensor's signal output. See page 7.
Optional Wafer Probe Classification
An optional wafer classification is available for users of the PI3012A devices. To achieve the highest degree of amplitude uniformity, the wafers are sorted and classified. The wafers are rank in accordance to their output amplitudes. Accordingly the users are assured of a greater uniform output from a CIS module when the sensors are selected from the same wafer.
(c)1999 Peripheral Imaging Corporation. Printed in USA. All rights reserved. Specifications are subject to change without notice. Contents may not be reproduced in whole or in part without the express prior written permission of Peripheral Imaging Corporation. Information furnished herein is believed to be accurate and reliable. However, no responsibility is assumed by Peripheral Imaging Corporation for its use nor for any infringement of patents or other rights granted by implication or otherwise under any patent or patent rights of Peripheral Imaging Corporation.
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